Resistive random access memory having multi-cell memory bits

ABSTRACT

Some embodiments include methods of storing and retrieving data for an RRAM array. The array is subdivided into a plurality of memory bits, with each memory bit having at least two memory cells. A memory bit is programmed by simultaneously changing resistive states of all memory cells within the memory bit. The memory bit is read by determining summed current through all memory cells within the memory bit. Some embodiments include RRAM having a plurality of memory cells. Each of the memory cells is uniquely addressed through a bitline/wordline combination. Memory bits contain multiple memory cells coupled together, with the coupled memory cells within each memory bit being in the same resistive state as one another.

RELATED PATENT DATA

This patent resulted from a divisional of U.S. patent application Ser.No. 13/855,208 which was filed Apr. 2, 2013 and which is herebyincorporated by reference herein.

TECHNICAL FIELD

RRAM, and methods of storing and retrieving information for RRAM.

BACKGROUND

Memory is one type of integrated circuitry, and is used in systems forstoring data. Memory is usually fabricated in one or more arrays ofindividual memory cells. A memory bit is the smallest unit ofinformation retained in a memory array. Each memory cell may correspondto a single memory bit having two different selectable states. In abinary system, the states are considered as either a “0” or a “1”.

Resistive random access memory (RRAM) is a class of memory that is ofinterest for utilization in existing and future data storage needs. RRAMutilizes programmable material having two or more stable states thatdiffer in resistivity relative to one another. Example types of memorycells that may be utilized in RRAM are phase change memory (PCM) cells,programmable metallization cells (PMCs), conductive bridging randomaccess memory (CBRAM) cells, nanobridge memory cells, electrolyte memorycells, binary oxide cells, and multilayer oxide cells (for instance,cells utilizing multivalent oxides). The memory cell types are notmutually exclusive. For example, CBRAM and PMC are overlappingclassification sets.

An example prior art RRAM cell 10 is shown in FIG. 1 as transitioningbetween two memory states. One of the memory states is a high resistancestate (HRS) and the other is a low resistance state (LRS). The memorycell comprises programmable material 16 between a pair of electrodes 12and 14. The programmable material may be a single homogeneouscomposition (as shown) or may comprise two or more discrete layers.

The electrode 12 is connected to circuitry 18, and the electrode 14 isconnected to circuitry 22. Circuitries 18 and 22 may include senseand/or access lines coupled to the electrodes, and configured forproviding appropriate electric fields across the memory cell duringread/write operations. In some embodiments, the illustrated memory cellmay be one of a plurality of memory cells of a memory array, and thecircuitries 18 and 22 may be part of a circuit configuration utilized touniquely address each of the memory cells of the array. In someembodiments, a “select device” (not shown) may be provided adjacent thememory cell 10 to reduce undesired current leakage to and/or from thememory cell during utilization of the memory cell in a memory array.Example select devices include diodes, transistors, ovonic thresholdswitches, etc.

Application of electric field EF(+) across the memory cell 10 forms acurrent conducting transitory structure 20 extending through material16. The transitory structure 20 provides a low-resistance currentconduction path through cell 10; and thus formation of structure 20transitions the cell to the LRS configuration.

Application of electric field EF(−) degrades the structure 20, andreturns cell 10 to the HRS configuration. The electric field EF(−) maybe of opposite polarity to the electric field EF(+).

The transitory structure 20 may have numerous configurations dependingon the nature of the memory cell and of the programmable material, anddepending on the chemistry and physics involved in formation of thetransitory structure. For instance, the transitory structure may be acurrent conducting filament of ionic particles (the ionic particles maybe super-ionic clusters, individual ions, etc.). As another example, thetransitory structure may comprise a region of changed phase, alteredvacancy concentration, altered ion concentration (for instance, alteredoxygen ion concentration), etc.; which may or may not be part of afilament.

The memory cell 10 may be programmed by providing appropriate voltageacross the memory cell to transition from the HRS configuration to theLRS configuration or vice versa. The memory cell may be read byproviding suitable voltage across the memory cell to determine aresistance through the memory cell, while limiting the voltage to alevel which does not cause programming of the memory cell.

Difficulties may be encountered during operation of memory cells of anRRAM array due to variation of operational characteristics of the cellsacross the array. It is desired to develop methods and structures whichaddress such difficulties.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 diagrammatically illustrates two interchangeable memory states ofa prior art memory cell.

FIG. 2 graphically illustrates two populations of memory cells, with oneof the populations being in a high resistance state and another of thepopulations being in a low resistance state.

FIG. 3 graphically illustrates two populations of memory cells, and twopopulations of memory bits containing paired memory cells.

FIG. 4 is a diagrammatic circuit diagram of an example embodimentprogramming operation for an example embodiment RRAM array.

FIG. 5 is a diagrammatic circuit diagram of an example embodimentreading operation for the example embodiment RRAM array of FIG. 4.

FIG. 6 is a diagrammatic circuit diagram of an example embodimentprogramming operation for an example embodiment RRAM array.

FIG. 7 is a diagrammatic circuit diagram of an example embodimentreading operation for the example embodiment RRAM array of FIG. 6.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

The prior art memory cell 10 of FIG. 1 illustrates two memory states(HRS and LRS) which can be selectively programmed into the memory cell,and which ideally may be readily distinguishable from one another duringa read operation. However, an RRAM array may have a large population ofcells in the HRS configuration, and another large population of cells inthe LRS configuration; and there may be substantial variation of the HRSand LRS characteristics of the cells across the respective populations.FIG. 2 graphically illustrates the various memory cells of an exampleembodiment RRAM. Specifically, FIG. 2 comprises a graph 30 plotting theproperty of current through individual memory cells (as measured inarbitrary units, a.u., and as shown on a logarithmic scale on the x-axisof graph 30) versus the number of memory cells in the population havingsuch property (as delineated by sigma). Two populations of memory cellsare shown on the graph, with a first population being memory cellsintended to be in the LRS configuration, and shown by curve 32; and asecond population being memory cells intended to be in the HRSconfiguration, and shown by curve 34.

The population of memory cells intended to be in the HRS configurationall have high resistance (i.e., relatively low current on the x-axisscale utilized for graph 30). In contrast, the population of memorycells intended to be in the LRS configuration encompasses a wide rangeof resistivity. Most of the memory cells along curve 32 have lowresistivity (i.e., relatively high current on the x-axis scale utilizedfor graph 30). However, some of the memory cells along curve 32 havehigh resistivity, to the extent that there is a region 35(diagrammatically illustrated utilizing dashed lines) at which a smallnumber of memory cells intended to be in the LRS configuration haveresistivity which overlaps with cells intended to be in the HRSconfiguration.

The memory cells intended to be in the LRS configuration may have highresistivity for any of several reasons. For example, such memory cellsmay have never fully formed an appropriate electrically conductivetransitory structure (for instance, a structure analogous to thestructure 20 shown in FIG. 1) associated with the LRS configuration.Alternatively, or additionally, such transitory structure may havedegraded to reduce conductivity through the cells. Regardless of thereason for having memory cells intended to be in the LRS configurationwith too high resistivity, such memory cells are problematic in that thehigh resistivity of such cells would indicate that cells are in the HRSconfiguration rather than in the intended LRS configuration during aread operation.

The memory cells which are intended be in the LRS configuration, butwhich have high resistivity (and accordingly are within the region 35)may be considered to correspond to a “tail” on the curve 32 representingthe population of cells intended to be in the LRS configuration. Inother words, the memory cells intended to be in the LRS configurationwhich have problematic high resistivity are only a small fraction of thetotal population of cells intended to be in the LRS configuration.

In some embodiments, a method for compensating for the high resistivityof the memory cells in the “tail” of curve 32 takes advantage of therelatively small fraction of problematic memory cells represented bysuch “tail”. Specifically, memory bits are configured to comprise two ormore memory cells. For instance, in some applications the memory bitsmay be configured to each comprise two memory cells coupled together.The output from the coupled memory cells is summed together during aread operation. Since the population of memory cells intended to be inthe LRS configuration contains only a small fraction with problematichigh resistivity, the odds favor having cells with problematic highresistivity being combined with other cells having low resistivityrather than being combined one another. The memory cells may be arrangedin parallel within the memory bits so that the current through anindividual memory bit is a summed total of the currents of the memorycells within the memory bit (i.e., a parallel combination of theresistivities of the memory cells within the memory bit). Accordingly,as long as one of the cells in the memory bit has low resistivity, theoverall resistivity through the memory bit will be low.

A disadvantage of coupling multiple cells into individual memory bits isthat the overall storage density of the memory array will be reduced.For instance, if each memory bit comprises two memory cells, then thestorage density of the memory array is reduced to half of what it couldbe if each memory bit comprised only a single memory cell. Moregenerally, if an RRAM array comprises X memory cells, and Y memory cellsare incorporated into each memory bit, the RRAM will have no more thanX/Y memory bits. In contrast, a prior art RRAM array comprising a singlememory cell in each memory bit would comprise X memory bits.

The improved reliability achieved by coupling multiple memory cells intosingle memory bits can offset the disadvantage of reduced storagedensity in some applications. In some embodiments, the coupling ofmemory cells within each memory bit may be considered to improvesignal-to-noise as compared to utilizing only single memory cells inmemory bits.

FIG. 3 shows a graph 40 having identical axes to the graph 30 of FIG. 2,and graphically illustrates improvement that may be achieved by couplingtwo memory cells into each memory bit. The two populations of memorycells described with reference to FIG. 2 are shown in the graph of FIG.3, with one population being memory cells intended to be in the LRSconfiguration, and shown by curve 32; and another population beingmemory cells intended to be in the HRS configuration, and shown by curve34. Also shown are two populations of memory bits, with individualmemory bits containing paired memory cells and having resistivitiescorresponding to the parallel combination of resistivities of the pairedmemory cells. One of the populations of memory bits is formed by pairingmemory cells from curve 32. Such population is intended to be a lowresistivity state memory bit population, and is shown by curve 42.Another of the populations of memory bits is formed by pairing memorycells from curve 34. Such population is intended to be a highresistivity state memory bit population, and is shown by curve 44.

The memory bits in the high resistivity population of curve 44 all havehigh resistance, and the curve 44 is only modestly change relative tothe curve 34 corresponding to the individual memory cells.

The memory bits in the low resistivity population of curve 42 are all ofresistivity low enough to be distinguishable from memory bits in thehigh resistivity population of curve 44. In other words, the problematicoverlap region 35 of FIG. 2 does not exist relative to the memory bitpopulations of curves 42 and 44; and accordingly the low resistivitymemory bits of curve 42 can all be distinguished from the highresistivity memory bits of curve 44. A difference between the highestresistivity memory bit along curve 42 and the lowest resistivity memorybit along curve 44 may be considered to be a sensing window 46 suitablefor determining the difference between high resistivity memory bits andlow resistivity memory bits in a read operation. The coupling ofmultiple memory cells into individual memory bits has created a sensingwindow improved (i.e., widened) by at least about an order of magnitudeas compared to prior art memory bits lacking coupled memory cells.

The memory cells may be coupled through any suitable architecture toform the memory bits of FIG. 3. FIG. 4 shows an example programmingoperation utilizing an architecture in which wordlines are paired tocreate memory bits comprising paired memory cells. The operation of FIG.4 is illustrated utilizing a circuit diagram of a memory array 50. Thememory array comprises a plurality of bitlines (b10-b14), source lines(src) and wordlines (w10-w14). The memory array comprises memory cells52 (only some of which are labeled) represented as resistors, andcomprises select devices 54 (only some of which are labeled). The selectdevices may be any suitable devices; including, for example, fieldeffect transistors, bipolar junction transistors, diodes, ovonicthreshold switches, etc. The select devices are provided to alleviateproblematic leakage currents. In some embodiments, the select devicesmay be omitted if leakage currents are not problematic.

Two wordlines w11 and w12 are paired together, and an electrical pulseis provided along both wordlines as diagrammatically illustrated by anasterisk (*) at each of the wordlines. Also, an electrical pulse isprovided along bitline b12 as diagrammatically illustrated by anasterisk (*) at such bitline. The electrical pulses along w11, w12 andb12 cause two of the memory cells (illustrated as memory cells 52 a and52 b) to be programmed into a specific state, while the remaining memorycells are not programmed. The memory cells 52 a and 52 b may beprogrammed into the same state as one another, and specifically theresistivity of each of memory cells 52 a and 52 b may be substantiallysimultaneously changed so that both memory cells may be substantiallysimultaneously programmed into an HRS configuration or so that bothmemory cells may be substantially simultaneously programmed into an LRSconfiguration. The term “substantially simultaneously” encompassesoperations in which coupled memory cells are exposed to programmingconditions and either program simultaneously within limitations ofoperation and measurement, or program not quite simultaneously due tostochastic behavior of memory cells during programming operations. Insome embodiments, the coupled memory cells of a memory bit may beprogrammed entirely separately from one another, and thus the individualcoupled memory cells may be programmed in a manner such that they arenot simultaneously, or even substantially simultaneously, programmedrelative to one another.

The memory cells 52 a and 52 b are paired together into a single memorybit 56. The other memory cells 52 may be similarly paired into memorybits. Accordingly, the array 50 may be considered to be subdivided intoa plurality of memory bits, with each memory bit comprising two memorycells. Although the illustrated memory bits comprise two memory cells,in other embodiments memory bits may be configured to comprise more thantwo memory cells.

Referring to FIG. 5, the memory cells 52 a and 52 b of memory bit 56 areread by providing appropriate electrical pulses along w11, w12 and b12(as diagrammatically illustrated by asterisks (*)); with the read pulsesbeing of suitable duration and magnitude to determine a summed currentthrough memory cells 52 a and 52 b without altering a programming stateof memory bit 56. The reading of the coupled memory cells may beaccomplished by passing current along a path that extends through all ofthe coupled memory cells to thereby determine the summed current (asshown). Alternatively, in some embodiments the “coupled” memory cellsmay be read separately from one another (i.e., current passed throughindividual memory cells along paths which do not extend through all ofthe summed cells) and later the currents may be added together throughlogic (and/or through other programming circuitry or operations) tocreate the summed current of the coupled memory cells. Coupled memorycells of a bit may be considered to be read simultaneously with oneanother if current is passed along a path which extends through all ofthe coupled memory cells of the bit; and to be read in anon-simultaneous operation if current is passed through each memory cellof the bit and later the currents are summed together with an additionaloperation.

The illustrated configuration of memory array 50 has a plurality ofmemory cells 52 which are each uniquely addressed by the combination ofa wordline and bitline. In the shown embodiment, the memory cells ofmemory bit 56 are addressed by paired wordlines w11 and w12 and thesingle bitline b12. In other embodiments, analogous memory bits may beaddressed by paired bitlines and single wordlines.

FIGS. 4 and 5 generically illustrate select devices 54. FIGS. 6 and 7diagrammatically illustrate programming and reading operations,respectively, of an example embodiment memory array 60 comprising fieldeffect transistors 62 (only some which are labeled) as the selectdevices. The pulses on w11 and w12 are diagrammatically shown for theprogramming and reading operations. The illustrated embodiment utilizesthe same duration and magnitude pulse on w11 as on w12 for theprogramming and reading operations. In other embodiments, the pulseutilized on w11 may be different than that utilized on w12 for theprogramming operation, the reading operation, or both the programmingand reading operations.

The memory arrays discussed above may be incorporated into electronicsystems. Such electronic systems may be used in, for example, memorymodules, device drivers, power modules, communication modems, processormodules, and application-specific modules, and may include multilayer,multichip modules. The electronic systems may be any of a broad range ofsystems, such as, for example, clocks, televisions, cell phones,personal computers, automobiles, industrial control systems, aircraft,etc.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. The descriptionprovided herein, and the claims that follow, pertain to any structuresthat have the described relationships between various features,regardless of whether the structures are in the particular orientationof the drawings, or are rotated relative to such orientation.

The cross-sectional views of the accompanying illustrations only showfeatures within the planes of the cross-sections, and do not showmaterials behind the planes of the cross-sections in order to simplifythe drawings.

Some embodiments include a method of storing and retrieving data for anRRAM array of X memory cells in which Y memory cells a coupled to oneanother in each memory bit so that the RRAM array has no more than X/Ymemory bits. The coupled memory cells of each memory bit are maintainedin a common resistive state as one another during reading and writingoperations. The memory bits having coupled memory cells provide enhancedreliability as compared to memory bits having only single memory cells.

Some embodiments include a method of storing and retrieving data for anRRAM array. The array is subdivided into a plurality of memory bits,with each memory bit comprising at least two memory cells. A memory bitis programmed by substantially simultaneously changing resistive statesof all memory cells within the memory bit. The memory bit is read bydetermining summed current through all memory cells within the memorybit.

Some embodiments include RRAM comprising a plurality of memory cells,with each of the memory cells being uniquely addressed through abitline/wordline combination. The memory cells comprise programmablematerial having selectively interchangeable resistive states. Memorybits comprise multiple memory cells coupled together. The coupled memorycells within each memory bit are in the same resistive state as oneanother.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

I claim:
 1. Resistive random access memory, comprising: a pluralitymemory cells comprising programmable material; the programmable materialhaving selectively interchangeable resistive states; each of the memorycells being uniquely addressed through a bitline/wordline combination;and memory bits comprising multiple memory cells coupled together; thecoupled memory cells within each memory bit being in the same resistivestate as one another; wherein the memory bits comprise paired memorycells; and wherein the paired memory cells of memory bits are addressedby paired wordlines and individual bitlines.
 2. The resistive randomaccess memory of claim 1 comprising more than two coupled memory cellsin each memory bit.
 3. The resistive random access memory of claim 1wherein the resistive random access memory comprises phase changememory.
 4. The resistive random access memory of claim 1 wherein theresistive random access memory comprises multivalent metal oxide.
 5. Theresistive random access memory of claim 1 wherein the resistive randomaccess memory comprises conductive bridging random access memory.
 6. Theresistive random access memory of claim 1 wherein the resistive randomaccess memory comprises binary oxide.
 7. Resistive random access memory,comprising: a plurality of memory cells comprising programmablematerial; the programmable material having selectively interchangeableresistive states; each of the memory cells being uniquely addressedthrough a bitline/wordline combination; and memory bits comprisingmultiple memory cells coupled together; the coupled memory cells withineach memory bit being in the same resistive state as one another;wherein the memory bits comprise paired memory cells; and wherein thepaired memory cells of memory bits are addressed by paired bitlines andindividual wordlines.
 8. The resistive random access memory of claim 7comprising more than two coupled memory cells in each memory bit.
 9. Theresistive random access memory of claim 7 wherein the resistive randomaccess memory comprises phase change memory.
 10. The resistive randomaccess memory of claim 7 wherein the resistive random access memorycomprises multivalent metal oxide.
 11. The resistive random accessmemory of claim 7 wherein the resistive random access memory comprisesconductive bridging random access memory.
 12. The resistive randomaccess memory of claim 7 wherein the resistive random access memorycomprises binary oxide.
 13. Resistive random access memory, comprising:plurality of memory cells comprising programmable material; theprogrammable material having selectively interchangeable resistivestates; each of the memory cells being uniquely addressed through abitline/wordline combination; and memory bits each comprising a set ofmultiple of the memory cells coupled together and arranged in parallel;the set of coupled memory cells being in the same resistive state as oneanother, each set of coupled memory cell being configured to beseparately programmed relative to other sets of coupled memory cellscomprised by others of the memory bits; wherein each memory cell isuniquely addressed by the combination of a wordline and a bitline; andwherein the set of coupled memory cells is addressed by paired wordlinesand individual bitlines.
 14. Resistive random access memory, comprising:a plurality of memory cell comprising able material; the programmablematerial having selectively interchangeable resistive states; each ofthe memory cells being uniquely addressed through a bitline/wordlinecombination; and memory bits each comprising a set of multiple of thememory cells couple together and arranged in parallel; the set ofcoupled memory cells being in the same resistive state as one another,each set of coupled memory cell being configured to be separatelyprogrammed relative to other sets of coupled memory cells comprised byothers of the memory bits; wherein each memory cell is uniquelyaddressed by the combination of a wordline and a bitline; and whereinthe set of coupled memory cells is addressed by paired bitlines andindividual wordlines.